Features

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• Designed for safe handling and positioning of photonic integrated circuits (PICs) and optical substrates

• Viscously damped clamping mechanism provides smooth, controlled chip loading and unloading

• Controlled closure force helps prevent chipping and damage to substrates as thin as 0.25 mm

• Magnetic actuation enables repeatable, hands-free opening and closing for improved operator safety and convenience

• Accommodates substrate thicknesses from 0.25 mm to 1.00 mm

• Precision 30° wedge contact surfaces provide stable, repeatable chip positioning during alignment and testing

• Adjustable chip width setting supports devices from 3 mm to 12 mm wide

• Integrated scale allows rapid setup and consistent clamping force for repeatable device loading

• Ideal for photonic integrated circuit packaging, characterization, wafer-level testing, and optical alignment applications

• WCH-2.7 has 2.7mm wide beam: accommodates 3mm - 6mm chip lengths

• WCH-5.7 has 5.7mm wide beam: accommodates 6mm - 12mm chip lengths

• Mounts directly to the standard mounting plate of Luminos Positioners